본문

서브메뉴

Elastic Buckling Analysis of Laminated Composite Plates with Through-the-width Delamination Using EAS Solid Element
Elastic Buckling Analysis of Laminated Composite Plates with Through-the-width Delaminatio...
Elastic Buckling Analysis of Laminated Composite Plates with Through-the-width Delamination Using EAS Solid Element

Detailed Information

자료유형  
 보고서
ISSN  
12267988
서명/저자  
Elastic Buckling Analysis of Laminated Composite Plates with Through-the-width Delamination Using EAS Solid Element / Dae Yong Park
발행사항  
서울 : 대한토목학회, 2007.
형태사항  
pp. 17-30
키워드  
ELASTIC BUCKLING ANALYSIS LAMINATED COMPOSITE PLATES THROUGHTHEWIDTH DELAMINATION USING SOLID ELEMENT
기타저자  
Dae Yong Park
기본자료저록  
KSCE Journal of Civil Engineering : 2007년 1월(vol.11,no.1) 2007, 01
URL  
www.ksce.or.krhttp://
모체레코드  
모체정보확인
Control Number  
shingu:240288

MARC

 008070208s2007        ULKa    a                          ENG
■022    ▼a12267988
■245    ▼aElastic  Buckling  Analysis  of  Laminated  Composite  Plates  with  Through-the-width  Delamination  Using  EAS  Solid  Element▼dDae  Yong  Park
■260    ▼a서울▼b대한토목학회▼c2007.
■300    ▼app.  17-30
■653    ▼aELASTIC▼aBUCKLING▼aANALYSIS▼aLAMINATED▼aCOMPOSITE▼aPLATES▼aTHROUGHTHEWIDTH▼aDELAMINATION▼aUSING▼aSOLID▼aELEMENT
■700    ▼aDae  Yong  Park
■773    ▼tKSCE  Journal  of  Civil  Engineering▼g2007년  1월(vol.11,no.1)▼d2007,  01
■URL    ▼awww.ksce.or.krhttp://
■SIS    ▼aS030259▼b44304▼h3▼s2▼fD

Preview

Export

ChatGPT Discussion

AI Recommended Related Books


    New Books MORE
    Related books MORE
    Statistics for the past 3 years. Go to brief

    Подробнее информация.

    • Бронирование
    • не существует
    • Книга оказать запросу
    • моя папка
    • Первый запрос зрения
    материал
    Reg No. Количество платежных Местоположение статус Ленд информации

    * Бронирование доступны в заимствований книги. Чтобы сделать предварительный заказ, пожалуйста, нажмите кнопку бронирование

    Books borrowed together with this book

    Related books

    Related Popular Books

    도서위치